Oxford CMI-900 Bench-Top XRF Thickness Analyzer
About Us
The CMI900 is a cost effective, fast and high performance
XRF analyzer for measurement of coating thickness and
material composition.  

Fast and precise analysis is attained with a proportional
counter detector and 50W micro-focus X-ray tube  that
provide high sensitivity.  Simple element differentiation is
made with secondary beam filters that enable the
spectral separation of overlapping elements.

The CMI900 is supplied with over 800 pre-loaded
application methods and parameters.  Excellent long-term
stability is made possible by automatic thermal
compensation which measures the instrument
temperature and corrects for changes, giving stable
results.  Simple and rapid Spectrum Calibration routinely
checks the instrument performance (such as sensitivity)
and applies necessary corrections.
Western Analytical Solutions, LLC
Material Analyzers
When no standards are available, standard-less (fundamental parameters – FP)
analysis provides simplicity of setting up reliable quantitative results, while covering a
wide range of thicknesses and concentrations.  When standards are available, Empirical
calibrations provide the best accuracy. Only a few standards are necessary (typically 1
to 3).  Methods are created in minutes.  Oxford Instruments supplies certified standards
for best accuracy (A2LA and ISO/IEC 17025 accredited).

3 Base Options:
Each of the three base options is slotted to accommodate over-sized samples such as
large printed circuit boards
  • Fixed table -- Table position is fixed, this flat base assembly provides a platform
    ideally suited for parts that do not exceed 1.30” (33mm) in height.
  • Mini Well -- Adjustable in one inch (12.7mm) increments, this rack-styled chamber
    can accommodate parts up to 6.30”(160mm) in height
  • Programmable table -- This configuration provides users with automatic,
    programmable control of the parts being analysed.  Easily navigate the table to
    position the part being inspected to the precise point to be measured.  Standard
    table size is 22”d x 24”w (560mm x 600mm).  Travel is 7” x 7”.

Electronics and Circuit Board Manufacturing
  • Component reliability and quality assurance
  • Simultaneous solder alloy composition and thickness measurement
  • Analysis of gold and palladium thickness of electrical contacts
  • Coating thickness of NiP layer on computer hard disc
  • Analysis of very thin coatings (e.g. Au/Pd coatings of < 0.1 μm)

Metal Finishing
  • Minimise production cost of the plating process and maximise production output
  • Simultaneous single or multi elements coating thickness analysis and composition
  • Analysis of up to 4 layers (plus substrate)
  • Plating bath solution analysis
  • Unique calibrations for light element coating like diamond, aluminum, etc

Metals Alloy Composition and Identification
  • Rapid, non-destructive analysis of jewellery and other alloys
  • Precious metal alloy assay - Karat analysis
  • Material identification
  • Quantification of impurities
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DOWNLOADS:

CMI-900 Brochure (PDF)  

CMI-900 Jewelry Flyer (PDF)  

Link to Manufacturers Web Page