The CMI900 is a cost effective, fast and high performance XRF analyzer for measurement of coating thickness and material composition.
Fast and precise analysis is attained with a proportional counter detector and 50W micro-focus X-ray tube that provide high sensitivity. Simple element differentiation is made with secondary beam filters that enable the spectral separation of overlapping elements.
The CMI900 is supplied with over 800 pre-loaded application methods and parameters. Excellent long-term stability is made possible by automatic thermal compensation which measures the instrument temperature and corrects for changes, giving stable results. Simple and rapid Spectrum Calibration routinely checks the instrument performance (such as sensitivity) and applies necessary corrections.
Western Analytical Solutions, LLC
Material Analyzers
When no standards are available, standard-less (fundamental parameters – FP) analysis provides simplicity of setting up reliable quantitative results, while covering a wide range of thicknesses and concentrations. When standards are available, Empirical calibrations provide the best accuracy. Only a few standards are necessary (typically 1 to 3). Methods are created in minutes. Oxford Instruments supplies certified standards for best accuracy (A2LA and ISO/IEC 17025 accredited).
3 Base Options: Each of the three base options is slotted to accommodate over-sized samples such as large printed circuit boards
Fixed table -- Table position is fixed, this flat base assembly provides a platform ideally suited for parts that do not exceed 1.30” (33mm) in height.
Mini Well -- Adjustable in one inch (12.7mm) increments, this rack-styled chamber can accommodate parts up to 6.30”(160mm) in height
Programmable table -- This configuration provides users with automatic, programmable control of the parts being analysed. Easily navigate the table to position the part being inspected to the precise point to be measured. Standard table size is 22”d x 24”w (560mm x 600mm). Travel is 7” x 7”.
Electronics and Circuit Board Manufacturing
Component reliability and quality assurance
Simultaneous solder alloy composition and thickness measurement
Analysis of gold and palladium thickness of electrical contacts
Coating thickness of NiP layer on computer hard disc
Analysis of very thin coatings (e.g. Au/Pd coatings of < 0.1 μm)
Metal Finishing
Minimise production cost of the plating process and maximise production output
Simultaneous single or multi elements coating thickness analysis and composition
Analysis of up to 4 layers (plus substrate)
Plating bath solution analysis
Unique calibrations for light element coating like diamond, aluminum, etc
Metals Alloy Composition and Identification
Rapid, non-destructive analysis of jewellery and other alloys
Precious metal alloy assay - Karat analysis
Material identification
Quantification of impurities
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